Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

A. Halouani, A. Cherouat, M. Chaabane, M. Haddar
January 2020
Cite
Type
Journal article
Publication
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science

Add the full text or supplementary notes for the publication here using Markdown formatting.